Описание

Ключевые возможности и технические характеристикиFeatures
  • Compliance with 3GPP2 standard of physical layer specifications C.S0024 (Rel. 0, Rev. A, and Rev. B) including Subtype 0/1/2/3
  • One-button, standards-based measurements with pass/fail tests
  • Superior measurement speed for manufacturing with multiple measurements from a single acquisition using the EXM sequencer
Measurements
  • Reverse link: composite EVM and rho, CPE, CDE, I/Q chip errors, code domain, channel power, ACP, and SEM
  • Auto-detection for data channels QPSK, 8PSK, 16QAM, and 64QAM
  • For reverse link, supports channel types including pilot, RRI, data, ACK, DRC, DSC, and auxiliary pilot
Access features
  • License key upgradeable
  • Fixed and transportable licenses available
  • SCPI remote user interface
ОписаниеThe 1xEV-DO measurement application is for the EXM wireless test set and helps you easily achieve your manufacturing test goals for today&rsquo,s multi-format devices. It quickly performs standards-based measurements for compliance with 3GPP2 physical layer specifications C.S0024 (Rel. 0, Rev. A, and Rev. B) including Subtype 0/1/2/3. The EXM&rsquo,s flexible sequencer uses single acquisition multiple measurement (SAMM) techniques to provide high-speed calibration and verification of your devices and modules for maximum manufacturing throughput. Should issues arise, multiple color-coded result views help you quickly identify them for quick resolution. Using the 1xEV-DO measurement application and EXM wireless test set makes it easy to rapidly ramp up and optimize full-volume manufacturing. It&rsquo,s the solution that lets you solve today and evolve tomorrow.''